Mobile foonu PCBA ọkọ
Awọn ọja ẹya-ara
● -HDI / Eyikeyi-Layer / mSAP
● -Fine ila ati multilayer manufacture agbara
● -SMT ti ni ilọsiwaju ati lẹhin ohun elo apejọ
● -Orinrin iṣẹ ọwọ
● - Agbara idanwo iṣẹ ti a sọtọ
● - Awọn ohun elo pipadanu kekere
● -5G Iriri eriali
Iṣẹ wa
● Awọn iṣẹ wa: PCB iduro kan ati awọn iṣẹ iṣelọpọ itanna PCBA
● Iṣẹ iṣelọpọ PCB: Nilo faili Gerber (CAM350 RS274X), awọn faili PCB (Protel 99, AD, Eagle), bbl
● Awọn iṣẹ wiwa awọn ohun elo: Akojọ BOM pẹlu alaye nọmba apakan ati Onise
● Awọn iṣẹ apejọ PCB: Awọn faili ti o wa loke ati Yan ati Gbe awọn faili, iyaworan apejọ
● Awọn iṣẹ siseto & Awọn iṣẹ idanwo: Eto, introuction ati ọna idanwo ati be be lo.
● Awọn iṣẹ apejọ ile: Awọn faili 3D, igbesẹ tabi awọn omiiran
● Awọn iṣẹ imọ-ẹrọ yiyipada: Awọn ayẹwo ati awọn omiiran
● Cable & awọn iṣẹ apejọ waya: Specification & awọn omiiran
● Awọn iṣẹ miiran: Awọn iṣẹ ti a fi kun iye
PCB Imọ Agbara
Fẹlẹfẹlẹ | Ibi iṣelọpọ: 2 ~ 58 Layer / Pilot run: 64 layers |
O pọju.Sisanra | Ibi-gbóògì: 394mil (10mm) / Pilot run: 17.5mm |
Ohun elo | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Asiwaju free ohun elo) , Halogen-ọfẹ, Seramiki kun, Teflon, Polyimide, BT, PPO, PPE, arabara, Apa kan arabara, ati be be lo. |
Min.Iwọn/Alafo | Layer inu: 3mil/3mil (HOZ), Layer ita: 4mil/4mil(1OZ) |
O pọju.Sisanra Ejò | UL ijẹrisi: 6.0 iwon / Pilot run: 12OZ |
Min.Iho Iwon | Lilu ẹrọ: 8mil(0.2mm) Lesa lilu: 3mil(0.075mm) |
O pọju.Iwọn igbimọ | 1150mm × 560mm |
Apakan Ipin | 18:1 |
Dada Ipari | HASL, Gold Immersion, Tin Immersion, OSP, ENIG + OSP, Fadaka Immersion, ENEPIG, Ika goolu |
Ilana Pataki | Iho ti a sin, Iho afọju, Resistance ti a fi sinu, Agbara ti a fi sinu, arabara, arabara apakan, iwuwo giga apakan, liluho pada, ati iṣakoso Resistance |