Ọkan Duro itanna Aabo PCBA ọkọ olupese
Awọn ọja ẹya-ara
● Ohun elo: Fr-4
● Iwọn Layer: Awọn ipele 6
● PCB Sisanra: 1.2mm
● Min.Wa kakiri / Space Lode: 0.102mm / 0.1mm
● Min.Ti gbẹ iho: 0.1mm
● Nipasẹ Ilana: Tọọlu Vias
● Ipari Ilẹ: ENIG
Anfani
1) Awọn ọdun ti iriri ni iṣelọpọ iho-idaji, lilo ẹrọ Da Chuan Routing, ipa ọna idaji-iho lẹhinna yiyi apẹrẹ, pade awọn ibeere apẹrẹ ti o muna;
2) Iwọn ila ti o kere julọ ati aaye laini: 0.065 / 0.065mm, paadi BGA ti o kere julọ: 0.2mm, pade awọn aini pataki onibara;
3) Electroplated Copper Flling of Blind Holes nipasẹ Universal DVCP (Double Track Vertical Continuous Copper Plating Equip ment) lati rii daju pe ko si ofo ni awọn iho ati didara awọn ọja onibara;
4) Ipo ayẹwo ayẹwo ti o muna, iṣeduro ikore ọja awọn onibara.
PCBA imọ Agbara
| SMT | Iduro ipo: 20 um |
| Iwọn irinše:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| O pọju.paati iga :: 25mm | |
| O pọju.PCB iwọn: 680× 500mm | |
| Min.PCB iwọn: ko si lopin | |
| PCB sisanra: 0.3 to 6mm | |
| PCB iwuwo: 3KG | |
| Igbi-Solder | O pọju.PCB iwọn: 450mm |
| Min.PCB iwọn: ko si lopin | |
| Giga paati: Oke 120mm/Bot 15mm | |
| Lagun-Solder | Irin iru: apakan, odidi, inlay, sidestep |
| Ohun elo irin: Ejò, Aluminiomu | |
| Ipari dada: plating Au, plating sliver, plating Sn | |
| Oṣuwọn àpòòtọ afẹfẹ: kere ju 20% | |
| Tẹ-fit | Tẹ ibiti: 0-50KN |
| O pọju.PCB iwọn: 800X600mm | |
| Idanwo | ICT, Iwadii ti n fo, sisun, idanwo iṣẹ, gigun kẹkẹ iwọn otutu |
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
