Communication Device PCBA ọkọ
Awọn ọja ẹya-ara
●-Ika Layer giga to awọn Layer 40 (Zhuhai 2023)
● -5G Eriali
● -SI Iṣakoso
● -TDR/VNA
Awọn iṣẹ wa
Ọkan-Duro PCB ati PCBA itanna ẹrọ awọn iṣẹ
Iṣẹ iṣelọpọ 1.PCB Nilo faili Gerber (CAM350 RS274X), awọn faili PCB (Protel 99, AD, Eagle), ati bẹbẹ lọ
2.Components Alagbase iṣẹ BOM akojọ to wa alaye Apá nọmba ati Designator
Awọn iṣẹ apejọ 3.PCB Awọn faili ti o wa loke ati Mu ati Gbe awọn faili, iyaworan apejọ
4.Programming & Igbeyewo Awọn iṣẹ Eto, ifihan ati ọna idanwo ati be be lo.
PCBA imọ Agbara
| SMT | Iduro ipo: 20 um |
| Iwọn irinše:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| O pọju.paati iga :: 25mm | |
| O pọju.PCB iwọn: 680× 500mm | |
| Min.PCB iwọn: ko si lopin | |
| PCB sisanra: 0.3 to 6mm | |
| PCB iwuwo: 3KG | |
| Igbi-Solder | O pọju.PCB iwọn: 450mm |
| Min.PCB iwọn: ko si lopin | |
| Giga paati: Oke 120mm/Bot 15mm | |
| Lagun-Solder | Irin iru: apakan, odidi, inlay, sidestep |
| Ohun elo irin: Ejò, Aluminiomu | |
| Ipari dada: plating Au, plating sliver, plating Sn | |
| Oṣuwọn àpòòtọ afẹfẹ: kere ju 20% | |
| Tẹ-fit | Tẹ ibiti: 0-50KN |
| O pọju.PCB iwọn: 800X600mm | |
| Idanwo | ICT, Iwadii ti n fo, sisun, idanwo iṣẹ, gigun kẹkẹ iwọn otutu |
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
