Kọmputa ati Agbeegbe PCBA ọkọ
Awọn ọja ẹya-ara
● -Ohun elo: Fr-4
● -Iwọn Iwọn: Awọn ipele 14
● -PCB Sisanra: 1.6mm
● -Min. itopase / Space Lode: 4/4mil
● -Min. Ti gbẹ iho: 0.25mm
● -Nipasẹ Ilana: Tọọti Vias
● -Ipari Ipari: ENIG
PCB be abuda
1. Solderresistant inki (Solderresistant/SolderMask): Kii ṣe gbogbo awọn aaye bàbà ni lati jẹ awọn ẹya tin, nitorinaa agbegbe ti ko jẹun ni yoo tẹ pẹlu ohun elo ti o fẹlẹfẹlẹ (nigbagbogbo resini epoxy) ti o ya dada Ejò kuro lati jijẹ tin si yago fun ti kii-soldering. Circuit kukuru kan wa laarin awọn ila tinned. Gẹgẹbi awọn ilana ti o yatọ, o pin si epo alawọ ewe, epo pupa ati epo buluu.
2. Dielectric Layer (Dielectric): A nlo lati ṣetọju idabobo laarin awọn ila ati awọn ipele, ti a mọ ni ipilẹ.
3. Itọju oju (SurtaceFinish): Niwọn igba ti ilẹ Ejò ti wa ni irọrun oxidized ni agbegbe gbogbogbo, ko le jẹ tinned (solderability talaka), nitorinaa dada Ejò lati jẹ tinned yoo ni aabo. Awọn ọna aabo pẹlu HASL, ENIG, Fadaka Immersion, Immersion Tin, ati olutọju ohun elo eleto (OSP). Ọna kọọkan ni awọn anfani ati alailanfani tirẹ, ti a tọka si bi itọju dada.
PCB Imọ Agbara
| Fẹlẹfẹlẹ | Ibi iṣelọpọ: 2 ~ 58 Layer / Pilot run: 64 layers |
| O pọju. Sisanra | Ibi-gbóògì: 394mil (10mm) / Pilot run: 17.5mm |
| Ohun elo | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free ijọ ohun elo) , Halogen-ọfẹ, Seramiki kun, Teflon, Polyimide, BT, PPO, PPE, arabara, Apa kan arabara, ati be be lo. |
| Min. Iwọn/Alafo | Layer inu: 3mil/3mil (HOZ), Layer ita: 4mil/4mil(1OZ) |
| O pọju. Sisanra Ejò | UL ijẹrisi: 6.0 iwon / Pilot run: 12OZ |
| Min. Iho Iwon | Lilu ẹrọ: 8mil(0.2mm) Lesa lilu: 3mil(0.075mm) |
| O pọju. Iwọn igbimọ | 1150mm × 560mm |
| Ipin ipin | 18:1 |
| Dada Ipari | HASL, Gold Immersion, Tin Immersion, OSP, ENIG + OSP, Fadaka Immersion, ENEPIG, Ika goolu |
| Ilana Pataki | Iho ti a sin, Iho afọju, Resistance ti a fi sinu, Agbara ti a fi sinu, arabara, arabara apakan, iwuwo giga apakan, liluho pada, ati iṣakoso Resistance |
