Ọkan Duro OEM PCB ati PCBA Electronic iṣẹ iṣelọpọ
Iṣẹ wa
● Awọn iṣẹ wa: PCB iduro kan ati awọn iṣẹ iṣelọpọ itanna PCBA
● Iṣẹ iṣelọpọ PCB: Nilo faili Gerber (CAM350 RS274X), awọn faili PCB (Protel 99, AD, Eagle), bbl
● Awọn iṣẹ wiwa awọn ohun elo: Akojọ BOM pẹlu alaye nọmba apakan ati Onise
● Awọn iṣẹ apejọ PCB: Awọn faili ti o wa loke ati Yan ati Gbe awọn faili, iyaworan apejọ
● Awọn iṣẹ siseto & Awọn iṣẹ idanwo: Eto, introuction ati ọna idanwo ati be be lo.
● Awọn iṣẹ apejọ ile: Awọn faili 3D, igbesẹ tabi awọn omiiran
● Awọn iṣẹ imọ-ẹrọ yiyipada: Awọn ayẹwo ati awọn omiiran
● Cable & awọn iṣẹ apejọ waya: Specification & awọn omiiran
● Awọn iṣẹ miiran: Awọn iṣẹ ti a fi kun iye
PCB Technical Agbara
| Fẹlẹfẹlẹ | Ibi iṣelọpọ: 2 ~ 58 Layer / Pilot run: 64 layers |
| O pọju.Sisanra | Ibi-gbóògì: 394mil (10mm) / Pilot run: 17.5mm |
| Ohun elo | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Asiwaju free ohun elo) , Halogen-ọfẹ, Seramiki kun, Teflon, Polyimide, BT, PPO, PPE, arabara, Apa kan arabara, ati be be lo. |
| Min.Iwọn/Alafo | Layer inu: 3mil/3mil (HOZ), Layer ita: 4mil/4mil(1OZ) |
| O pọju.Sisanra Ejò | UL ijẹrisi: 6.0 iwon / Pilot run: 12OZ |
| Min.Iho Iwon | Lilu ẹrọ: 8mil(0.2mm) Lesa lilu: 3mil(0.075mm) |
| O pọju.Iwọn igbimọ | 1150mm × 560mm |
| Apakan Ipin | 18:1 |
| Dada Ipari | HASL, Gold Immersion, Tin Immersion, OSP, ENIG + OSP, Fadaka Immersion, ENEPIG, Ika goolu |
| Ilana Pataki | Iho ti a sin, Iho afọju, Resistance ti a fi sinu, Agbara ti a fi sinu, arabara, arabara apakan, iwuwo giga apakan, liluho pada, ati iṣakoso Resistance |
PCB Technical Agbara
| SMT | Iduro ipo: 20 um |
| Iwọn irinše:0.4×0.2mm(01005) -130×79mm,Flip-CHIP,QFP,BGA,POP | |
| O pọju.paati iga :: 25mm | |
| O pọju.PCB iwọn: 680× 500mm | |
| Min.PCB iwọn: ko si lopin | |
| PCB sisanra: 0.3 to 6mm | |
| PCB iwuwo: 3KG | |
| Igbi-Solder | O pọju.PCB iwọn: 450mm |
| Min.PCB iwọn: ko si lopin | |
| Giga paati: Oke 120mm/Bot 15mm | |
| Lagun-Solder | Irin iru: apakan, odidi, inlay, sidestep |
| Ohun elo irin: Ejò, Aluminiomu | |
| Ipari dada: plating Au, plating sliver, plating Sn | |
| Oṣuwọn àpòòtọ afẹfẹ: kere ju 20% | |
| Tẹ-fit | Tẹ ibiti: 0-50KN |
| O pọju.PCB iwọn: 800X600mm | |
| Idanwo | ICT, Iwadii ti n fo, sisun, idanwo iṣẹ, gigun kẹkẹ iwọn otutu |
Kọ ifiranṣẹ rẹ nibi ki o si fi si wa
